Construction of the microchip factory by Taiwanese semiconductor manufacturer TSMC and other partners is on schedule. The first employees are expected to move into the factory offices on the outskirts of Dresden in mid-2027, as ESMC President Christian Koitzsch said in Dresden. “We will have installed the first machine by the end of the year.” Production is also scheduled to begin right on schedule.
Work at the construction site has been progressing rapidly since the groundbreaking in the summer of 2024. “We are now close to finishing the roof,” said Koitzsch. The roof structure consists of steel beams weighing over 100 metric tons. “We have four 650-metric-ton cranes in operation there, lifting this roof structure onto the roof and bolting it in place, so that by the end of the year we can hopefully announce that the factory is watertight.” Interior work is scheduled to begin afterward.
