Plastics with integrated microelectronic systems could revolutionize cell phones and mobile systems in the future. In the Ore Mountains, companies are working on such visions together with the Institute for Structural Lightweight Design at Chemnitz University of Technology (TU). The STRUKTRONIK project is exploring the possibilities of embedding microelectric systems in thermoplastic composites, which could significantly increase their functionality.
Dr. Jens Emmrich, head of the research area for active materials and composite structures at TU Chemnitz, is enthusiastic about the potential of the new technology. Until now, electronic components have been retrofitted into components, making it difficult to protect sensitive technology. However, by using organosheets and structure-supporting circuit boards, major advances could be made in the production and protection of the technology.
The potential applications of the new technology are diverse and spectacular. Dr. Emmrich sees future areas of application particularly in lightweight construction and electromobility. The goal of the STRUKTRONIK project is to develop a technology capable of large-scale production that enables additional functions in housings and replaces metals.
