Not much can yet be seen of the latest future-oriented project in Saxony. But in the coming months, Silicon Saxony - as the Free State of Saxony calls its microelectronics and semiconductor industry around Dresden, loosely based on Silicon Valley in California - is set to go from strength to strength. In 2027, the Taiwanese company TSMC and three partners plan to produce chips in the north of Dresden, primarily for the automotive industry. The world's largest contract manufacturer of silicon microelectronics is thus coming to Europe. The symbolic ground-breaking ceremony is to take place today, with Federal Chancellor Olaf Scholz (SPD) and EU Commission President Ursula von der Leyen expected as guests.
What is the timetable?
First, the excavation pit will be dug. According to ESMC President Christian Koitzsch, the plant will have a footprint of 200 by 200 meters and will be ten meters deep. Most of the 500,000 cubic meters of excavated earth will be spread over the adjacent site. The building shell will then be constructed, the clean room will be installed in 2027 and production will begin. The TSMC plants in Japan and in the US state of Arizona were also scrutinized in advance in order to draw conclusions about Dresden. However, there is no problem in Saxony: the structure does not have to be earthquake-proof.
What exactly is to be produced?
In contrast to the chips for high-performance smartphones, the semiconductors from the new plant in Dresden will not be manufactured using the latest 3- or 4-nanometer processes, but with higher structure widths. Such conventional chips are common in the automotive industry. With the spread of connected vehicles and electric cars, the industry needs more and more of them.